Often a standard package size–such as 0402 for passives or SOT for ICs–is used, which is extremely helpful for ensuring part dimensions are accurate. These dimensions are determined solely by the component manufacturer. Nevertheless, as listed below, there are still significant issues that must be addressed before your board design is ready for the manufacturer.Ĭommon PCB Component Footprint Design IssuesĮlectronic components come in all shapes and sizes. SMD footprint example for the MCF8316a sensorĬreating component footprints manually or from scratch is easier due to the ECAD tools available. There was a time when being a good PCBA designer required creating accurate footprints from drawings, such as the one below, from manufacturer datasheets. These constraints stipulated in the IPC 751 standard are in place to ensure that fabricators and assemblers can create structurally sound and reliable board constructions. Additionally, there are limitations and constraints on component attributes, such as pin size, pitch, and separation, that must be adhered to.
Surface mount components are only attached to the board’s surface therefore, failing to achieve precise alignment can result in several manufacturing and performance issues. SMD footprints, however, can be more complicated. Designing landing patterns for through hole components are simple enough, although proper annular ring size and drill hole aspect ratios must be correct. One of the most crucial aspects of PCBA design that can simultaneously be the most difficult to perform is the creation of component footprints and landing patterns.
0 kommentar(er)
